Grégory Houzet

Enseignant-Chercheur, Section 63 du CNU
Université Savoie Mont Blanc
Laboratoire CROMA, UMR CNRS 5130

2025

A. L. Perrier, G. Houzet, J. Outin, E. Rochefeuille, B. Stutz and T. Lacrevaz, "Permittivity characterization of conductive and corrosive LiBr water solutions, method validation up to 9 GHz using a low-cost SMA probe", Sensors, vol. 25, p. 789, Jan. 2025.
A. Biard, G. Houzet, E. Rochefeuille, T. Lacrevaz, P. Artillan et O. Lavastre, "Mesures en hyperfréquences de l’évaporation du glucose dans un sérum physiologique", JCMM 2025, Saint-Etienne, Mars 2025.
L. Ibily, T. Lacrevaz, G. Houzet, W. Feuray et T. P. Vuong, "Conception et analyse d’un métamatériau ultrafin absorbant à double bandes", JCMM 2025, Saint-Etienne, Mars 2025.

2024

A. L. Perrier, G. Houzet, J. Outin, E. Rochefeuille, B. Stutz and T. Lacrevaz, "Characterization of corrosive Lithium-Bromide/Water solutions up to 6 GHz using a low cost SMA connector", IEEE International Conference on Electrical, Computer, Communications and Mechatronics Engineering (4th ICECCME), Malé, Maldives, Nov. 2024.
T. Carron, G. Houzet, S. Talbot, D. Wayntal and D. Telisson, "Ecological transition via IoT approach in training process", IEEE International Conference on Electrical, Computer, Communications and Mechatronics Engineering (4th ICECCME), Malé, Maldives, Nov. 2024.
M. Bahrouni, T. P. Vuong, G. Houzet et H. Trabelsi, "Conception d’une antenne implantable bi-bande à profil bas pour applications biomédicales", JNM 2024, Antibes, Juin 2024.

2023

M. Bahrouni, G. Houzet, T. P. Vuong, P. M. Mendes, H. Dinis, R. Silva and H. Trabelsi, "Modeling of a compact, implantable, dual‐band antenna for biomedical applications", Electronics, vol. 12, p. 1475, March 2023.
M. Bahrouni, G. Houzet, H. Trabelsi and T. P. Vuong, "A low profile dual band implantable antenna for biomedical applications", IEEE Mediterranean Microwave Symposium (22nd MMS), Sousse, Tunisia, Oct. 2023.
T. H. L. Dam, A. Niembro-Martin, T. Lacrevaz, G. Houzet, D. Paulet, N. Reverdy-Bruas, Q. B. Duong and T. P. Vuong, "Switchable FSS-based 3D printed radome using diodes at 3.6 GHz", European Microwave Conference (53rd EuMC), pp. 416-419, Berlin, Germany, Sept. 2023.
T. H. L. Dam, G. Houzet, T. Lacrevaz and T. P. Vuong, "Diode-based switchable frequency selective surface at 3.6 GHz", IEEE AP-S/URSI 2023, Portland, USA, July 2023.
T. H. L. Dam, V. Thenot, G. Depres, T. Lacrevaz, G. Houzet, T. P. Vuong, P. Xavier et B. Flechet, "Conception et caractérisation d’une antenne reconfigurable réalisée par impression d’encre sur papier pour des applications 4G et 5G", JCMM 2023, Tours, Avr. 2023.
A. L. Perrier, G. Houzet, J. Outin, E. Rochefeuille, B. Flechet, B. Stutz et T. Lacrevaz, "Caractérisation jusqu’à 9 GHz de solutions corrosives eau/bromure de lithium à l’aide d’un connecteur SMA faible coût", JCMM 2023, Tours, Avr. 2023.

2022

T. H. L. Dam, G. Houzet, T. Lacrevaz and T. P. Vuong, "High gain Vivaldi antenna from 26 up to 40 GHz for 5G applications", Microwave and Optical Technology Letters, vol. 64, pp. 1267-1271, July 2022.
T. H. L. Dam, G. Houzet, T. Lacrevaz, G. Gaborit and T. P. Vuong, "Investigation of phase compensation lens to improve the gain of Vivaldi antenna in Ka-band", IEEE 9th International Conference on Communications and Electronics (ICCE), pp. 265-268, Nha Trang, Vietnam, July 2022.
T. H. L. Dam, V. Thenot, G. Depres, T. Lacrevaz, G. Houzet, T. P. Vuong and P. Xavier, "Reconfigurable screen-printed patch antenna on paper for 4G and 5G applications", European Microwave Conference (52nd EuMC), pp. 64-67, Milan, Italy, Sept. 2022.
T. H. L. Dam, A. Niembro-Martin, T. Lacrevaz, G. Houzet, C. Delfaut, D. Paulet, N. Reverdy-Bruas, Q. B. Duong and T. P. Vuong, "Study of a 3D FSS-based printed radome demonstrator for a patch antenna at 3.6 GHz", European Microwave Conference (52nd EuMC), pp. 664-667, Milan, Italy, Sept. 2022.
T. H. L. Dam, C. Delfaut, G. Houzet, T. Lacrevaz, B. Flechet, D. Paulet, Q. B. Duong, A. Niembro-Martin, N. Reverdy-Bruas et T. P. Vuong, "Reconfiguration du diagramme de rayonnement d'une antenne dédiée à la 5G à l'aide d'un radôme imprimé en 3D", JNM 2022, Limoges, Juin 2022.

2021

G. Houzet, T. Lacrevaz, C. Bermond, P. Artillan, D. Auchere, L. Schwarz and B. Flechet, "In-situ characterization up to 100 GHz of insulators used in new 3D "System in Package on Board" (SiPoB) technologies", Microelectronics Journal, vol. 108, p. 104990, Feb. 2021.
T. H. L. Dam, C. Delfaut, G. Houzet, T. Lacrevaz, A. Niembro-Martin, Q. B. Duong, N. Reverdy-Bruas and T. P. Vuong, "Printed radome for reconfigurable antenna radiation pattern in 5G applications", IEEE AP-S/URSI 2021, Singapore, Dec. 2021.

2020

T. Lacrevaz, G. Houzet, C. Bermond, P. Artillan, D. Auchere, L. Schwarz et B. Flechet, "Caractérisation in-situ jusqu'à 100 GHz d'isolants utilisés dans les nouvelles technologies 3D de type System in Package on Board (SiPoB)", JCMM 2020, Toulouse, Nov. 2020.

2019

G. Houzet, P. Artillan, C. Bermond, T. Lacrevaz and B. Flechet, "Turnkey methodology for characteristic impedance extraction of embedded transmission lines", 23rd IEEE Workshop on Signal and Power Integrity (SPI), pp. 1–4, Chambéry, France, June 2019.

2018

T. Carron, G. Houzet, H. Abed, P. Pernelle, P. J. Laine and S. Talbot, "Teaching digital literacy: the outcomes of a learning lab", Journal of Electrical Engineering, vol. 6, pp. 75–84, March 2018.
T. Lacrevaz, D. Auchere, G. Houzet, P. Artillan, B. Flechet, C. Bermond and B. Blampey, "Fast and robust RF characterization method of insulators used in high speed interconnects networks", 22nd IEEE Workshop on Signal and Power Integrity (SPI), pp. 1–4, Brest, France, May 2018.
T. Lacrevaz, D. Auchere, G. Houzet, P. Artillan, B. Flechet, C. Bermond et B. Blampey, "Méthode de caractérisation large bande de fréquence de matériaux isolants par contact direct sonde de mesure / échantillon", JCMM 2018, Paris, Mars 2018.

2017

K. Dieng, P. Artillan, C. Bermond, O. Guiller, T. Lacrevaz, S. Joblot, G. Houzet, A. Farcy, Y. Lamy, A. L. Perrier and B. Flechet, "Modeling and frequency performance analysis of Through Silicon Capacitors in silicon interposers", IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, pp. 477–484, Apr. 2017.
C. Cadieux, M. Rabarot, O. Ledoux, M. Martinez, E. Guiot, G. Houzet, T. Lacrevaz and B. Flechet, "InP composite substrate for low-cost high-end RF applications", 9th International Conference on Materials for Advanced Technologies, Singapore, June 2017.
K. Dieng, C. Bermond, P. Artillan, O. Guiller, T. Lacrevaz, S. Joblot, G. Houzet, A. Farcy, Y. Lamy et B. Flechet, "Modélisation et caractérisation de capacités 3D: application au découplage de réseaux d’alimentation", Telecom’2017 & 10èmes JFMMA, Rabat, Maroc, Mai 2017.

2016

K. Dieng, C. Bermond, P. Artillan, O. Guiller, T. Lacrevaz, S. Joblot, G. Houzet, A. Farcy, Y. Lamy and B. Flechet, "Electrical model of different architectures of Through Silicon Capacitors for high frequency Power Distribution Network (PDN) decoupling operations", 66th IEEE Electronic Components and Technology Conference, pp. 74–81, Las Vegas, USA, May 2016.
K. Dieng, C. Bermond, P. Artillan, O. Guiller, T. Lacrevaz, S. Joblot, G. Houzet, A. Farcy, Y. Lamy and B. Flechet, "High frequency modeling of Through Silicon Capacitors (TSC) architectures in silicon interposer", 20th IEEE Workshop on Signal and Power Integrity (SPI), pp. 1–4, Turin, Italy, May 2016.
K. Dieng, P. Artillan, C. Bermond, O. Guiller, T. Lacrevaz, S. Joblot, G. Houzet, A. Farcy, Y. Lamy et B. Flechet, "Modèle électrique et caractérisation à haute fréquence de condensateurs intégrés dans l’épaisseur d’un interposeur silicium", JCMM 2016, Calais, Mars 2016.

2015

J. C. Marty, T. Carron, P. Pernelle, S. Talbot and G. Houzet, "Mixed reality games", International Journal of Game-Based Learning, vol. 5, pp. 32–47, March 2015.
K. Dieng, P. Artillan, C. Bermond, O. Guiller, T. Lacrevaz, S. Joblot, G. Houzet, A. Farcy, Y. Lamy and B. Flechet, "Through Silicon Capacitors (TSC) for noise reduction in power distribution network", 65th IEEE Electronic Components and Technology Conference, pp. 247–253, San Diego, USA, May 2015.
K. Dieng, P. Artillan, C. Bermond, O. Guiller, T. Lacrevaz, S. Joblot, G. Houzet, A. Farcy, Y. Lamy et B. Flechet, "Modélisation et caractérisation de capacités 3D dans un interposeur silicium", Telecom’2015 & 9èmes JFMMA, Meknès, Maroc, Mai 2015.
P. Artillan, K. Dieng, C. Bermond, O. Guiller, T. Lacrevaz, S. Joblot, G. Houzet, A. Farcy, Y. Lamy et B. Flechet, "Modèle électrique et caractérisation à haute fréquence de condensateurs intégrés sur interposeur silicium", JNM 2015, Bordeaux, Juin 2015.

2014

P. Queffelec, V. Laur, A. Chevalier, J. M. Le Floch, D. Passerieux, D. Cros, V. Madrangeas, A. Le Febvrier, S. Deputier, M. Guilloux-Viry, G. Houzet, T. Lacrevaz, C. Bermond and B. Flechet, "Intercomparison of permittivity measurement techniques for ferroelectric thin layers", Journal of Applied Physics, vol. 115, p. 024103, Jan. 2014.
G. Houzet, T. Lacrevaz, C. Bermond, B. Flechet, A. Le Febvrier, S. Deputier, M. Guilloux-Viry and P. Queffelec, "Characterization in a wide frequency range (40 MHz – 67 GHz) of a KTa0.65Nb0.35O3 thin film for tunable applications", Integrated Ferroelectrics, vol. 158, pp. 52–61, 2014.
T. Lacrevaz, C. Bermond, O. El Bouayadi, G. Houzet, P. Artillan, Y. Lamy, K. Dieng and B. Flechet, "Electrical broadband characterization method of dielectric molding in 3-D IC and results", IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, pp. 1515–1522, Sept. 2014.
K. Dieng, P. Artillan, C. Bermond, O. Guiller, T. Lacrevaz, S. Joblot, G. Houzet, A. Farcy, Y. Lamy and B. Flechet, "Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer", 3D Systems Integration Conference, pp. 1–8, Kinsdale, Ireland, Dec. 2014.
G. Houzet, P. Artillan, C. Bermond, T. Lacrevaz, K. Dieng et B. Flechet, "Méthode robuste d’extraction de paramètres de ligne de transmission en vue d’application à la caractérisation de matériaux", JCMM 2014, Nantes, Mars 2014.
C. Bermond, T. Lacrevaz, O. El Bouayadi, P. Artillan, G. Houzet, Y. Lamy et B. Flechet, "Méthodologie et résultats de caractérisation large bande d’une couche diélectrique enfouie dans un empilement de circuits intégrés 3D", JCMM 2014, Nantes, Mars 2014.

2013

J. C. Marty, T. Carron, S. Talbot, G. Houzet and P. Pernelle, "Integrating non-virtual electronic activities in game-based learning environement", 7th European Conference on Game Based Learning, pp. 378–385, Porto, Portugal, Oct. 2013.
G. Houzet, T. Lacrevaz, C. Bermond, A. Le Febvrier, S. Deputier, M. Guilloux-Viry, P. Queffelec and B. Flechet, "Refined characterization up to millimetre waves of ferroelectric KTN thin film for efficient integrated tunable devices", ECS Transactions, vol. 58, pp. 237–242, Aug. 2013.
T. Lacrevaz, C. Bermond, B. Flechet, Y. Lamy, O. El Bouayadi, G. Houzet and P. Artillan, "Performance of molding materials and interconnections integrated in interposers dedicated to RF or microwave 3DIC applications", 19th European Microelectronics Packaging Conference, pp. 1–7, Grenoble, France, Sept. 2013.
J. Roullard, A. Farcy, S. Capraro, T. Lacrevaz, C. Bermond, G. Houzet, J. Charbonnier, C. Fuchs, C. Ferrandon, P. Leduc and B. Flechet, "Some strategic tracks to optimize routing of high speed signal transmission between memory and logic in 3D-IC stacks", 224th ECS Meeting, Invited talk, p. 2052, San Francisco, USA, Oct. 2013.
E. Eid, T. Lacrevaz, G. Houzet, C. Bermond, P. Artillan et B. Flechet, "Impact des effets de couplage par les substrats sur l’intégrité des signaux numériques rapides dans les empilements 3D de circuits intégrés", Telecom’2013 & 8èmes JFMMA, Marrakech, Maroc, Mars 2013.

2012

M. Brocard, E. Eid, T. Lacrevaz, C. Bermond, G. Houzet, A. Farcy, P. Leduc and B. Flechet, "Focus on links between high frequency substrate noise and high speed signal transmission in interconnection channels of 3D-IC", Micro-Nano-Electronics Packaging and Assembly, Designand Manufacturing Forum (MInaPAD), Grenoble, France, Apr. 2012.
E. Eid, T. Lacrevaz, G. Houzet, C. Bermond, B. Flechet, A. Farcy, F. Calmon and P. Leduc, "Effects of silicon substrate coupling phenomena on signal integrity for RF or high speed communications in 3D-IC", 62th IEEE Electronic Components and Technology Conference, pp. 827–833, San Diego, USA, May 2012.
J. Roullard, A. Farcy, S. Capraro, T. Lacrevaz, C. Bermond, G. Houzet, J. Charbonnier, C. Fuchs, C. Ferrandon, P. Leduc and B. Flechet, "Evaluation of 3D interconnects routing and stacking strategy to optimize high speed signal transmission for memory on logic", 62th IEEE Electronic Components and Technology Conference, pp. 8–13, San Diego, USA, May 2012.
G. Houzet, K. Blary, S. Lepilliet, D. Lippens, L. Burgnies, G. Velu, J. C. Carru, E. Nguema and P. Mounaix, "Ionic polarization occurrence in BaSrTiO3 thin film by THz-time domain spectroscopy", Ferroelectrics, vol. 430, pp. 36–41, June 2012.
G. Houzet, T. Lacrevaz, C. Bermond, A. Le Febvrier, S. Deputier, M. Guilloux-Viry, K. Blary et B. Flechet, "Extraction entre 40 MHz et 67 GHz de la permittivité complexe du KTa0.65Nb0.35O3 déposé en couche mince", JCMM 2012, Chambéry, Mars 2012.
C. Bermond, J. Abergel, G. Le Rhun, E. Defay, G. Houzet, T. Lacrevaz et B. Flechet, "Étude jusqu’à 60 GHz d’une capacité ferroélectrique de PbZr0.52Ti0.48O3", JCMM 2012, Chambéry, Mars 2012.
F. Rasoanoavy, V. Laur, P. Queffelec, J. M. Le Floch, D. Passerieux, D. Cros, V. Madrangeas, A. Le Febvrier, S. Deputier, M. Guilloux-Viry, G. Houzet, T. Lacrevaz, C. Bermond et B. Flechet, "Intercomparaisons de caractérisations électromagnétiques de couches minces ferroélectriques", JCMM 2012, Chambéry, Mars 2012.

2011

G. Houzet, K. Blary, S. Lepilliet, D. Lippens, L. Burgnies, G. Velu, J. C. Carru, E. Nguema and P. Mounaix, "Dielectric dispersion of BaSrTiO3 thin film from centimeter to submillimeter wavelengths", Journal of Applied Physics, vol. 109, p. 014116, Jan. 2011.

2010

G. Houzet, X. Melique, D. Lippens, L. Burgnies, G. Velu and J. C. Carru, "Microstrip transmission line loaded by split-ring resonators tuned by ferroelectric thin film", Progress in Electromagnetics Research C, vol. 12, pp. 225–236, March 2010.
G. Houzet, L. Burgnies, X. Melique, G. Velu, J. C. Carru et D. Lippens, "Métamatériaux à base de microrésonnateurs fendus accordables par films minces ferroélectriques", JCMM 2010, Brest, Mars 2010.

2009

A. Marteau, G. Velu, G. Houzet, L. Burgnies, E. Lheurette, J. C. Carru and D. Lippens, "Ferroelectric tunable balanced right-left handed transmission line", Applied Physics Letters,vol. 94, p. 023507, Jan. 2009.
F. Zhang, C. Croenne, G. Houzet, D. Gaillot, X. Melique, E. Lheurette and D. Lippens, "Metameterial technologies at Terahertz frequencies", Progress In Electromagnetics Research Symposium, Beijing, China, March 2009.
G. Houzet, X. Melique, G. Velu, L. Burgnies, J. C. Carru and D. Lippens, "Microstrip transmission lines loaded by SRRs tunabled by ferroelectrics", Metamaterials 2009, London, United Kingdom, Sept. 2009.
G. Houzet, L. Burgnies, K. Blary, G. Velu, J. C. Carru et D. Lippens, "Propriétés diélectriques de films BST jusqu’à 110 GHz : applications aux varactors en bandes millimétriques", JNM2009, Grenoble, Mai 2009.
G. Houzet, G. Velu, A. Marteau, L. Burgnies, E. Lheurette, J. C. Carru et D. Lippens, "Ligne de transmission composite équilibrée fonctionnant en bandes Ku et K", JNM 2009, Grenoble, Mai 2009.
C. Croenne, G. Houzet, A. L. Borja, X. Melique, E. Lheurette et D. Lippens, "Bio capteurs à base de micro-résonateurs fendus", JNM 2009, Grenoble, Mai 2009.
F. Zhang, G. Houzet, C. Croenne, E. Lheurette et D. Lippens, "Réfraction négative dans les métamatériaux", JNM 2009, Grenoble, Mai 2009.

2008

F. Zhang, G. Houzet, E. Lheurette, D. Lippens, M. Chaubet and X. P. Zhao, "Negative-zero-positive metamaterial with omega-type metal inclusions", Journal of Applied Physics, vol. 103, p. 084312, Apr. 2008.
L. Burgnies, G. Velu, G. Houzet, K. Blary, J. C. Carru and D. Lippens, "A TRL-like calibration for tunable interdigitated BST varactors", IEEE Transactions on Instrumentation and Measurement, vol. 57, pp. 1127–1132, June 2008.
G. Houzet, L. Burgnies, G. Velu, J. C. Carru and D. Lippens, "Dispersion and loss of ferroelectric Ba0.5Sr0.5TiO3 thin films up to 110 GHz", Applied Physics Letters, vol. 93, p. 053507, Aug. 2008.
E. Lheurette, G. Houzet, J. Carbonell, F. Zhang, O. Vanbesien and D. Lippens, "Omega-type balanced composite negative refractive index materials", IEEE Transactions on Antennas and Propagation, vol. 56, pp. 3462–3469, Nov. 2008.
G. Houzet, L. Burgnies, S. Lepilliet, G. Velu, K. Blary, J. C. Carru et D. Lippens, "Permittivité complexe du ferroélectrique BaSrTiO3 aux longueurs d’ondes millimétriques", JCMM 2008, Limoges, Avril 2008.
A. Kalfalaoui, G. Houzet, G. Velu, L. Burgnies, J. C. Carru et D. Lippens, "Structuration submicronique sur oxydes ferroélectriques : applications aux circuits millimétriques agiles", Workshop oxydes fonctionnels pour l’intégration en micro et nanoélectronique, Autrans, Mars 2008.

2007

G. Velu, K. Blary, L. Burgnies, A. Marteau, G. Houzet, D. Lippens and J. C. Carru, "A 360° BST phase shifter with moderate bias voltage at 30 GHz", IEEE Transactions on Microwave Theory and Techniques, vol. 55, pp. 438–444, Feb. 2007.
F. Zhang, G. Houzet, S. Potet, E. Lheurette, M. Chaubet and D. Lippens, "Metamaterials-based routing devices for space applications", International Symposium on Signals Systems and Electronics, pp. 223–226, Montreal, Canada, July 2007.
G. Velu, G. Houzet, L. Burgnies, J. C. Carru, A. Marteau, K. Blary, D. Lippens, P. Mounaix, M. Tondusson and E. Nguema, "Electrical characterizations of paraelectric BST thin films up to 1 THz. Realization of microwave phaseshifters", Ferroelectrics, vol. 353, pp. 29–37, Aug. 2007.
G. Velu, L. Burgnies, G. Houzet, K. Blary, D. Lippens and J. C. Carru, "Characterization of ferroelectric films up to 60 GHz: application to phase shifters", Integrated Ferroelectrics, vol. 93, pp. 110–118, Sept. 2007.
G. Houzet, A. Marteau, G. Velu, E. Lheurette, L. Burgnies, J. C. Carru and D. Lippens, "Voltage-controlled composite metamaterials via the loaded transmission line approach", Metamaterials 2007, Rome, Italy, Oct. 2007.
J. Carbonell, G. Houzet, C. Croenne, E. Lheurette, V. Boria and D. Lippens, "Non linear frequency and space selective materials", Metamaterials 2007, Rome, Italy, Oct. 2007.
G. Velu, L. Burgnies, G. Houzet, K. Blary, D. Lippens et J. C. Carru, "Caractérisation jusqu’à 60 GHz de films ferroélectriques BST", JCF 2007, Calais, Octobre 2007.
E. Lheurette, G. Houzet, J. Clay, G. Velu, L. Burgnies, J. C. Carru et D. Lippens, "Effet varactor dans les lignes de transmission main gauche – main droite à base de film BST", JCF 2007, Calais, Octobre 2007.
G. Houzet, E. Lheurette, V. Sadaune, M. Bouzouad, O. Vanbesien, M. Chaubet et D. Lippens, "Dispositifs sélectifs en angle à base de métamatériaux gauchers", JNM 2007, Toulouse, Mai 2007.
E. Lheurette, J. Carbonell, G. Houzet, O. Vanbesien, M. Chaubet et D. Lippens, "Métamatériaux large bande à base de réseaux de motifs Omega interconnectés", JNM 2007, Toulouse, Mai 2007.
L. Burgnies, G. Velu, K. Blary, G. Houzet, D. Lippens et J. C. Carru, "Caractérisation microondes de condensateurs interdigités accordables sur film BST", JNM 2007, Toulouse, Mai 2007.
G. Velu, G. Houzet, L. Burgnies, K. Blary, D. Lippens et J. C. Carru, "Déphaseurs 60 GHz à base de films minces ferroélectriques", JNM 2007, Toulouse, Mai 2007.
A. Marteau, G. Houzet, K. Blary, E. Lheurette, D. Lippens, G. Velu, L. Burgnies et J. C. Carru, "Lignes de transmission main gauche – main droite accordables par matériaux ferroélectriques", JNM 2007, Toulouse, Mai 2007.
D. Gaillot, C. Croenne, G. Houzet, N. Fabre, X. Melique, O. Vanbesien, C. Summers et D. Lippens, "Des cristaux photoniques aux métamatériaux diélectriques par résonance de MIE", 4èmes journées Térahertz, Bombannes, Mai 2007.